STATS ChipPAC Ltd. Announces Acceptance Results of Tender Offer

STATS ChipPAC Ltd.
("STATS ChipPAC" or the "Company") (NASDAQ: STTS) (SGX-ST: STATSChP), a
leading independent semiconductor test and advanced packaging service
provider, announced today that it had accepted tenders equal to
$149,000,000 (approximately 99.3%) of its outstanding unregistered 7.5%
Senior Notes due 2010 (the "Existing Notes") in connection with its offer
to exchange its Existing Notes for 7.5% Senior Notes due 2010 that have
been registered under the Securities Act of 1933, with some of the Existing
Notes being tendered pursuant to guaranteed delivery procedures. Holders
that tendered their Existing Notes prior to the expiration of the exchange
offer pursuant to guaranteed delivery procedures have five business days
from the execution date of the notice of guaranteed delivery to present
certificates for all physically tendered Existing Notes or a book-entry
confirmation to the exchange agent.

$1,000,000 principal amount of the Existing Notes remain outstanding. The
Company confirmed that, as previously announced, the exchange offer expired
at 5:00 p.m. New York City time, on October 19, 2005 and the Company
expects to settle the exchange offer as soon as practicable thereafter.

You may request information related to the exchange offer from U.S. Bank
National Association at (800) 934-6802.

This notice shall not constitute an offer to sell or the solicitation of an
offer to buy nor shall there be any sale of these securities in any state
in which such offer, solicitation or sale would be unlawful prior to the
registration or qualification under the securities laws of any such state.

About STATS ChipPAC Ltd.

STATS ChipPAC Ltd. ("STATS ChipPAC" or the "Company" -- NNM: STTS and
SGX-ST: STATSChP) is a leading service provider of semiconductor packaging
design, assembly, test and distribution solutions. A trusted partner and
supplier to leading semiconductor companies worldwide, STATS ChipPAC
provides fully integrated, multi-site, end-to-end packaging and testing
solutions that bring products to market faster. Our customers are some of
the largest wafer foundries, integrated device manufacturers (IDMs) and
fabless companies in the United States, Europe and Asia. STATS ChipPAC is a
leader in mixed signal testing and advanced packaging technology for
semiconductors used in diverse end market applications including
communications, power, digital consumer and computing. With advanced
process technology capabilities and a global manufacturing presence
spanning Singapore, South Korea, China, Malaysia and Taiwan, STATS ChipPAC
has a reputation for providing dependable, high quality test and packaging
solutions. The Company's customer support offices are centered in the
United States (California's Silicon Valley, Arizona, Texas, Massachusetts,
Florida, Colorado and North Carolina). Our offices outside the United
States are located in the Netherlands, United Kingdom, China, Singapore,
Japan, Taiwan, South Korea and Malaysia. STATS ChipPAC's facilities
include those of its subsidiary, Winstek Semiconductor Corporation, in
Hsinchu Valley, Taiwan. These facilities offer new product introduction
support, pre-production wafer sort, final test, packaging and other high
volume preparatory services. Together with our research and development
centers in Singapore and South Korea as well as test facilities in the
United States, this forms a global network providing dedicated test
engineering development and product engineering support for customers from
design to volume production. STATS ChipPAC is listed on both the Nasdaq
National Market and the Singapore Exchange Securities Trading Limited. In
addition, STATS ChipPAC is also listed on the Morgan Stanley Capital
International (MSCI) Index and the Straits Times Industrial Index. Further
information is available at www.statschippac.com. Information contained in
this website does not constitute a part of this release. Unless otherwise
specified, references to "$" are to the lawful currency of the United
States of America.



Singapore Contact :
Lee Ching Ching
Senior Investor Relations Manager
Tel : (65) 6824 7705, Fax : (65) 6720 7826
email : Email Contact
US Contacts :
Drew Davies
Director, Investor Relations
Tel : (408) 586 0608, Fax : (408) 586 0652
email : Email Contact
Lisa Lavin
Marcom Manager
Tel : (208) 939 3104, Fax : (208) 939 4817
email : Email Contact
The Ruth Group
David Pasquale - Executive Vice President
Tel : (646) 536 7006
email : Email Contact
SOURCE: STATS ChipPAC

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