Nam Tai Electronic & Electrical Products Announces Upgraded COB Technology

Nam Tai Electronic & Electrical Products Limited (''NTEEP'' or ''the Company'') (HKEX stock code: 2633), a leading vertically-integrated manufacturing solutions provider of consumer
electronics and communications products, announced that it has successfully
upgraded its Chip On Board (''COB'') production technology to include gold
wire ball bonding for manufacturing CMOS image sensor modules in mega pixel
level quality.

In response to its customers' strong demand for high resolution CMOS image
sensor modules to be used in image capturing device such as cellular phones
with built in camera function, the Company has upgraded its COB production
technology by investing in new gold wire ball bonding COB equipment and
related facilities. With the completed installation of upgraded COB equipment
and successful pilot production run of high resolution CMOS image sensor
modules, the Company is now capable of producing CMOS image sensor modules in
various package forms and further reduce the risk of component shortage and
improve cost efficiency.

''There is a growing demand for CMOS image sensor modules with better
image quality,'' said Mr. Joseph Hsu, Chief Financial Officer of NTEEP.
''With our ongoing advancement of our manufacturing capabilities, we believe
that Nam Tai is well positioned to respond to the demand from the fast growing
electronic manufacturing industry, especially the optical device area, and to
capture more business opportunities arising in this area.''

For more information about NTEEP please visit its website at
http://www.namtaieep.com .

For more information about NTE, please visit its website at
http://www.namtai.com .

For more information, please contact:

Nam Tai Group Management Limited
Joyce Lam/ Marcus Keung
Tel: +852-2263-1014/2263-1022
Fax: +852-2263-1223
Email: joycelam@namtai.com.hk or marcus@namtai.com.hk

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