MagnaChip to Present at the Deutsche Bank 2006 Next Generation Semiconductor Summit

MagnaChip Semiconductor today announced that the Company will present at the Deutsche Bank 2006 Next Generation Semiconductor Summit in Santa Clara, California. Dale Lindly, Chief Accounting Officer of MagnaChip, will present at the conference. Presentations will not be webcast at the conference.

Place: The Hyatt Regency Santa Clara, Santa Clara, California

Date: March 22, 2006

Time: 11:30 a.m. PT in Santa Clara / 2:30 p.m. ET in New York

(4:30 a.m. Korea Time, March 23, 2006)

About MagnaChip Semiconductor

MagnaChip Semiconductor is a leading designer, developer and manufacturer of mixed-signal and digital multimedia semiconductors addressing the convergence of consumer electronics and communications devices. We focus on CMOS image sensors and flat panel display drivers, which are complex, high performance, mixed signal semiconductors that capture images and enable and enhance the features and capabilities of both small and large flat panel displays. MagnaChip also provides wafer foundry services utilizing CMOS high voltage, embedded memory, analog and power process technologies for the manufacture of IC's for customer-owned designs. MagnaChip has world-class manufacturing capabilities and an extensive portfolio of approximately 12,300 registered and pending patents. As a result, MagnaChip is a valued partner in providing leading technology solutions to its customers worldwide. For more information, visit http://www.magnachip.com.

CONTACTS:

In Korea:

Youngjae Chang, PR Manager

Tel: 82-2-3459-5884

youngjae.chang@magnachip.com

In the U.S.:

David Pasquale, EVP at The Ruth Group

Tel: +646-536-7006

dpasquale@theruthgroup.com

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