LogicVision Announces Tundra Semiconductor Successfully Delivers Silicon With LogicVision 1149.6 Boundary Scan26 December 2006
LogicVision, Inc. (Nasdaq: LGVN), a leading provider of semiconductor test and yield learning solutions, today announced that Tundra Semiconductor Corporation (TSX: TUN), the leader in System Interconnect, has successfully delivered final silicon to customers, utilizing LogicVision's boundary scan solution to support the IEEE 1149.6 standard for high-speed interconnects in its Serial RapidIO(R) Switches. The Tundra Tsi57x family of switches, provide chip-to-chip interconnect between RapidIO end-points and can replace existing proprietary backplane fabrics for board-to-board interconnect. "We looked at the available 1149.6 solutions in the market and only LogicVision provided the complete solution we needed," said Rick O'Connor, Chief Technology Officer at Tundra. "Using LogicVision's solution we were able to deliver leading edge 1149.6 capability as required by our customers on time and within specifications." LogicVision's ETBoundary(TM) product provides a boundary scan solution for embedded test and diagnosis of integrated circuit pin functions and board- level interconnect. Access is provided through LogicVision's Test Access Port interface using the IEEE 1149.1 (JTAG) and 1149.6 (ACJTAG) protocols. The relatively new 1149.6 standard is intended for the differential and AC-coupled signals used for multi-gigahertz serial data. ETBoundary automates the design, integration, verification, and production test pattern generation for boundary scan test of I/Os, even for pins that cannot be connected to test equipment because they are too fast or sensitive. "Tundra selected our 1149.6 solution because of our leadership in defining this new standard in IEEE and being the first company to offer a complete solution to the market," said Farhad Hayat, vice president of marketing at LogicVision. "Their success in implementing this solution in silicon validates the robustness of our solution and is further evidence of our leadership in delivering innovative DFT solutions for high speed I/Os." About LogicVision, Inc. LogicVision, Inc. provides unique test and yield learning capabilities in the design for manufacturing space. These capabilities enable its customers, leading semiconductor companies, to more quickly and efficiently learn to improve product yields. The company's advanced Design for Test (DFT) product line, ETCreate, works together with ETAccess Products Family and Yield Insight yield learning applications to improve profit margins by reducing device field returns, reducing test costs, and accelerating both time to market and time to yield. LogicVision solutions are used in the development of semiconductor ICs for products ranging from digital consumer goods to wireless communications devices and satellite systems. LogicVision was founded in 1992 and is headquartered in San Jose, Calif. For more information visit http://www.logicvision.com. About Tundra Semiconductor Corporation Tundra Semiconductor Corporation (TSX:TUN) is the global leader in System Interconnect providing world-class customer and technical support, leading- edge semiconductor solutions and design services to the world's foremost communications, networking, storage system, and information technology vendors. Consistently delivering on system level performance promises that reduce time to market, Tundra System Interconnect products ensure market advantage in wireless infrastructure, storage networking, network access, military, industrial automation, and information technology applications. Silicon Logic Engineering, Inc. (SLE), Tundra's semiconductor design services division, offers industry-leading ASIC design services, semiconductor intellectual property and product development consulting. For more information, please visit http://www.tundra.com. About Tundra RapidIO(R) Switches Tundra switches provide chip-to-chip interconnect between RapidIO end- points and can replace existing proprietary backplane fabrics for board-to- board interconnect. As a founding member of the RapidIO Trade Association and long-time Steering Committee member, Tundra continues to provide leadership in the development of the RapidIO standard and was the first semiconductor vendor to bring Parallel and Serial RapidIO switches to market. RapidIO is the leading serial interconnect standard for embedded systems and is supported by industry leaders such as, Alcatel, AMCC, EMC Corporation, Ericsson, Freescale Semiconductor, Lucent Technologies and Texas Instruments. The Tundra family of RapidIO switches includes the Tsi578(TM), Tsi574(TM), Tsi576(TM), Tsi568A(TM), Tsi564A(TM) and Tsi500(TM). Forward Looking Statements Except for the historical information contained herein, the matters set forth in this press release, including statements as to the expected features and benefits of our products, and the expected benefits of Tundra's adoption of our products, are forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995. These forward-looking statements are subject to risks and uncertainties that could cause actual results to differ materially, including, but not limited to, the impact of competing products and technologies, the risk that the expected benefits to Tundra of adopting our products will not be realized, and other risks detailed in LogicVision's Form 10-Q for the quarter ended September 30, 2006, and from time to time in LogicVision's SEC reports. These forward-looking statements speak only as of the date hereof. LogicVision disclaims any obligation to update these forward-looking statements. TUNDRA and the Tundra logo are registered marks of Tundra Semiconductor Corporation in Canada, the European Union and the People's Republic of China (registration is pending in the United States). Tsi578, Tsi576, Tsi574, Tsi568A, Tsi564A and Tsi500 are trademarks of Tundra Semiconductor Corporation. RapidIO is a trademark of the RapidIO Trade Association, Inc. Other registered and unregistered trademarks are the property of their respective owners. Development of Tundra's Tsi 574(TM), Tsi576(TM), and Tsi578(TM) were made possible in part with the assistance of the Technology Partnerships Canada Program.
Source: prnewswire
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