Experts to Explore Lead Free Manufacturing Process Challenges

SMT manufacturing experts will explore the day's leading lead free SMT manufacturing process challenges in a free, live webcast seminar set for Thursday, Feb. 17, 2005 at 11 am, U.S. Eastern Time.

The one-hour webinar, to be presented by Speedline Technologies, will focus on the electronics industry's move to lead-free assemblies. Process issues abound throughout the industry as companies begin removing hazardous lead from electronic packages and reducing the dependency on lead materials that can leach into the environment during processing or disposal. The effort is global and is driven by environmental considerations, governmental legislation, and the marketing advantages of lead-free electronic packages.

Hosted by experts who have been developing and implementing manufacturing techniques for more than 20 years, the interactive webinar will feature live discussions of process challenges, new technologies, and how-to implementation information - as well as participant questions and answers.

Participation is as easy as visiting a website and dialing into a toll-free telephone number. Topics will include:

-- Overview of the lead-free transition

-- Definition of a lead-free process

-- Regulatory update

-- Lead-free alloys: advantages and disadvantages

-- Process considerations for equipment selection

-- Printed circuit board design considerations

-- Process impact on quality

-- Failure modes

The webinar is free. To register, or for more information, visit http://www.speedlinetech.com/seminars on the Web, or call +1 508-541-4749.

Future webinar topics and dates are as follows. All are one-hour sessions and are scheduled to begin at 11 a.m., U.S. E.T.

-- Thurs., Mar. 17: Lead-Free Wave Soldering

-- Thurs., Apr. 14: Lead-Free Reflow Soldering

-- Thurs., May 19: Lead-Free Reflow Soldering Power & Nitrogen Consumption

-- Thurs., Jun. 16: Underfill Dispensing

-- Thurs., July 21: Fine Pitch Printing

-- Thurs., Aug. 18: Lead-Free Overview

-- Thurs., Sept. 15: Lead-Free Wave Soldering

-- Thurs., Oct. 20: Lead-Free Reflow Soldering

-- Thurs., Nov. 17: Tin Whiskers

-- Thurs., Dec. 15: Fine Pitch Printing

Contact Speedline Technologies online at http://www.speedlinetech.com, or:

-- USA: Speedline Technologies, 16 Forge Park, Franklin, MA 02038 USA, Tel: 1-508-520-0083, Fax: 1-508-520-2288, E-mail: info@speedlinetech.com;

-- Europe: Speedline Technologies GmbH, Im Gefierth 14, 63303 Dreieich, Germany, Tel: +49 (0)6103/832-0, Fax: +49(0)6103/832-299, E-mail: info.europe@speedlinetech.com;

-- Asia: Speedline Technologies Asia Pte Ltd, 150 Kampong Ampat, #05-08 KA Centre, Singapore 368324, Tel: 65-6286-6635, Fax: 65-6289-9411, E-mail: asiamarketing@speedlinetech.com.

Contacts

Speedline Technologies, Inc.
Kathleen Murray, 508-541-6415
email: kamurray@speedlinetech.com
www.speedlinetech.com
or
Tiziani Whitmyre, Inc.
Don Goncalves, 781-793-9380
email: dgoncalves@tizinc.com
www.tizinc.com

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