Endicott Interconnect Technologies Partners with Speedline Technologies on MPM Accela Printer Advances1 August 2006
Speedline Technologies, the global leader in process knowledge and expertise for the PCB assembly and semiconductor packaging industries, announced today that Endicott Interconnect Technologies (EI) has chosen the award-winning MPM Accela printer for their most challenging SMT and semiconductor back-end assembly processes. "The sophisticated Accela printer provides a strong foundation as we jointly work to extend its capability in order to offer advanced packaging solutions to our customers," stated Don Webster, EI Process Engineer overseeing the project. "This innovative development partnership with Speedline Technologies helps EI to meet increased market demand and ultimately provides real competitive advantage," he continued. Speedline and EI are conducting beta testing on several new, advanced hardware and software options for the Accela. These advances will extend the technological leadership of the MPM Accela by leveraging Speedline's patented texture-based inspection algorithms to develop exponentially higher resolution 2D inspection capabilities. This new development will enable the ultra-fine feature 2D capabilities required by emerging higher-density assemblies that employ smaller or finer pitch components. In addition to this joint inspection development, EI plans to use the Accela printers to process substrates in flat carriers, as well as perform fine feature assembly inspection in their Endicott, New York facility. "Speedline Technologies is thrilled to be working so closely with EI on these joint technology developments. We believe that our best process knowledge solutions have always been developed hand-in-hand with world-class organizations. This partnership will deliver benefit to customers worldwide, as EI's current needs and future plans mirror the leading edge of our industry. Their demanding requirements will drive well-defined product definitions that shall yield easy-to-use tools for many advanced process needs," said John Ufford, Vice-President of Engineering for Speedline Technologies. About Accela Speedline's MPM Accela printer provides the accuracy, repeatability, and flexibility to meet the surging quality demands of the most complex assemblies and print processes. With this innovative stencil printer, a new standard of productivity has become a manufacturing reality -- aided by unique parallel processing and a superior design that reduces the causes of downtime, Accela achieves throughput gains of more than 20% over the nearest competitors. A winner of the Global SMT, SMT VISION, and EMAsia Innovation Awards, the Accela employs 7 patented and 5 patent-pending innovations to deliver improved throughput and reduced operating costs. Learn more at http://www.speedlinetech.com/mpm/accela-videos.aspx About Endicott Interconnect Technologies Endicott Interconnect Technologies, Inc., with headquarters in Endicott, NY, is a world-class supplier of electronic interconnects solutions consisting of fabrication and assembly of complex PCBs, advanced flip chip and wire bond semiconductor packaging as well as precision equipment manufacturing and integration. EI product lines meet the needs of markets including IT, telecommunications, advanced test equipment, medical, power management, defense and aerospace, where highly reliable products built in robust manufacturing operations are critical for success. With more than 40 years experience in providing microelectronics solutions, the company brings to market a unique mix of leading edge technology and technical know how that provide customers with a time-to-market advantage and competitive differentiation. For more information about EI and its products, please visit http://www.endicottinterconnect.com. About Speedline Technologies Speedline Technologies is the global leader in process knowledge and expertise for the PCB assembly and semiconductor packaging industries. Based in Franklin, Massachusetts, U.S.A., the company markets five best-in-class brands -- Accel microelectronics cleaning equipment; Camalot dispensing systems; Electrovert wave soldering, reflow soldering, and cleaning equipment; MPM stencil and screen printing systems; and Protect global services, support, and training solutions. Speedline Technologies is Frost & Sullivan's "2005 Surface Mount Technology Company of the Year" and has earned their "2006 Competitive Strategy Leadership Award". For more information, visit: http://www.speedlinetech.com or contact Speedline at: * USA: Speedline Technologies, 16 Forge Park, Franklin, MA 02038 USA, Tel: 1-508-520-0083, Fax: 1-508-520-2288, E-mail: info@speedlinetech.com * Europe: Speedline Technologies GmbH, Im Gefierth 14, 63303 Dreieich, Germany, Tel: +49 (0)6103/832-0, Fax: +49(0)6103/832-299, E-mail: info.europe@speedlinetech.com * Asia: Speedline Technologies Asia Pte Ltd, 150 Kampong Ampat, #05-08 KA Centre, Singapore 368324, Tel: 65-6286-6635, Fax: 65-6289-9411, E-mail: asiamarketing@speedlinetech.com Press Contacts: Endicott Interconnect Technologies, Inc. Theresa Taro Director of Marketing and Communications (607) 755-1847 Theresa.Taro@eitny.com Speedline Technologies Steve Martin, bold (617) 909-5363 steve@wearebold.com
Source: prnewswire
All trademarks and copyrighted information contained herein are the property of their respective owners.
Related Articles
- Nam Tai Electronics, Inc. Announces 2006 Second Quarter Results
1 August 2006
- PSi Technologies Issues Announcement Pursuant to Nasdaq Marketplace Rule 4350(b)
1 August 2006
- Power Efficiency Corporation Joins Leading Motor, Motor Drive and Appliance Manufacturers in Prestigious Motor and Electronics Research Consortium
31 July 2006
- Henry Bros. Electronics to Report Second Quarter 2006 Results on August 7, 2006
31 July 2006
- LightScribe Direct Disc Labeling Now Offered by Over 70 Electronics and Software Companies
28 July 2006
- PennWell's SMT Magazine and the Rochester Institute of Technology Center for Electronics Manufacturing and Assembly Announce Implementing Lead-Free: A
28 July 2006
- NEC, NEC Electronics, Matsushita, Panasonic Mobile and Texas Instruments Establish New Joint Venture to Develop Communications Platform for Mobile Han
28 July 2006
- NEC, NEC Electronics, Matsushita, Panasonic Mobile and Texas Instruments Establish New Joint Venture to Develop Communications Platform for Mobile Han
28 July 2006
- Samsung Electronics Canada Partners with Wayne Gretzky Foundation on 'Samsung's Four Seasons of Hope'
28 July 2006
- Directed Electronics, Inc. to Present at the 9th Annual JP Morgan Harbour Auto Conference
27 July 2006
|