Credence Introduces Next-Generation Complete Lab Analysis and Debug Solution at ISTFA

Credence Systems Corporation (Nasdaq: CMOS), a leading provider of test solutions from design to production for the worldwide semiconductor industry, today announced the introduction of a complete laboratory design test solution that helps integrated device manufacturers (IDMs) and fabless semiconductor companies reduce the time it takes to bring new products to market. This next-generation suite of products, which includes design debug, failure analysis, and circuit edit tools, as well as navigation software and a new frontside probe preparation system, will be featured in the Credence booth (#307) at the International Symposium for Testing and Failure Analysis (ISTFA). ISTFA runs November 6-10 at the McEnery Convention Center, San Jose, California. "Traditional diagnostic and electrical failure analysis tools can no longer be relied upon to deliver the level of fault analysis required to bring today's advanced devices to market in a timely fashion," said Ofir Baharav, senior vice president and general manager of Credence's Diagnostics and Characterization Group. "Our next-generation solutions include all of the advanced tools necessary to enable debug and failure analysis, while protecting critical IP in the fabless/foundry relationship in one complete package." Design Analysis Credence's EmiScope(R)-III and GlobalScan(TM)-III are third-generation backside analysis tools designed to perform failure analysis and debug on today's advanced integrated circuits (ICs). The EmiScope is the industry- standard tool for non-invasive measurements of IC internal electrical activity. It uses infrared, time-resolved photon emission technology to make waveform measurements on any cell in a circuit with point-and-click simplicity. The GlobalScan is the most advanced platform for laser-based fault and performance marginality isolation. It can quickly isolate resistive interconnects, leaky gates and other manufacturing defects, as well as more subtle defects causing marginal time, voltage or temperature behaviors. These newest offerings include high-power spray cooling capable of handling up to 200 W/cm2. Options include a point-and-click < 0.25 um optical resolution solid immersion lens, electronics with picosecond timing accuracy, field-proven inverted-column tester docking and a mature GUI interface. Circuit Editing Credence's OptiFIB(TM)-III and P3X-III FIB instruments deliver circuit- editing capabilities for 65 nm and smaller technology nodes. These next- generation tools offer higher edit throughput and unparalleled edit success rates, as well as advanced circuit edit capability. They are intended to help create working engineering samples, as well as to validate mask changes before high-volume production. Key features include: a high-accuracy stage and laser interferometer option for faster accurate navigation across a device; edit automation for frontside edits, as well as through silicon edits for higher throughput; higher edit throughput on copper metallization with CU2 chemistry option; and sub pico-Amp beam current imaging, editing and sensitive end- pointing with a patented detector for higher edit success rates. Emission Microscopy Credence's IREM-II and IREM-XP next-generation tools deliver the advanced microscopy technology required to validate a VLSI circuit's design, while addressing yield and reliability issues. The IREM-XP is intended for use at the sub-0.15 um node, while the IREM-II is intended for sub-0.1 um technology. Both of these instruments use a high-sensitivity InGaAs focal plane array and proprietary high numerical aperture optics and are optimized for photo emission applications between 0.9 and 1.5 um emission wavelengths. Both offer unmatched signal-to-noise ratio enabling faint emissions from operating devices to be detected within a very short integration time. Additionally, the IREM laser scanning microscope (LSM) option provides rapid and accurate global defect localization to complement IREM's fault localization capabilities. By utilizing optimized laser sources, custom optics, highly sensitive detection electronics, and powerful software features, the platform enables the failure analyst to obtain a comprehensive understanding of device failures for quick root cause analysis. Navigation Software Credence's Navigation Exchange Server (NEXS) framework provides full navigation compatibility between Credence failure analysis, debug, and FIB systems, while also delivering the ability to link to Credence or other NEXS- compatible third-party schematic and layout tools. The NEXS product family includes the NEXS Layout Tool, which provides a fast and efficient method for directly reading and displaying GDS2 design file data; the NEXS Silicon GPS, which streamlines cross-mapping between logic cells, ports, nets and physical CAD coordinates by using LEF/DEF files without requiring the use of LVS data; and the NEXS Schematic Viewer, which provides an easy method for reading netlists and displaying graphical schematics. Frontside Fixed Probe This new Credence die repackaging system delivers a reliable, robust technique for mounting and connecting loose dies and wafer fragments and frees the user from reliance on costly and delicate micromanipulator probes in the diagnostic test environment. A low-cost PGA device mount, coupled with a custom DUT card and easy-to-use manual wire bonding station provides a complete system for rapid creation of frontside test setups. About Credence Credence Systems Corporation is the industry's leading provider of design- to-test solutions for the global semiconductor industry. With a commitment to applying innovative technology to lower the cost-of-test, Credence delivers competitive cost and performance advantages to integrated device manufacturers (IDMs), wafer foundries, outsource assembly and test (OSAT) suppliers and fabless chip companies worldwide. A global, ISO 9001-certified company with a presence in 20 countries, Credence is headquartered in Milpitas, California. More information is available at http://www.credence.com . NOTE: Credence and EmiScope are registered trademarks, and Credence Systems, GlobalScan and OptiFIB are trademarks of Credence Systems Corporation. Other trademarks that may be mentioned in this release are the intellectual property of their respective owners. Company Contact: Judy A.E. Dale Vice President, Marketing Communications and Investor Relations Credence Systems Corporation Phone: 408-635-4309 FAX: 408-635-4986 E-mail: judy_dale@credence.com

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